Leadinq-in conductor



Aug. 30, 1927. 1,640,469

V. L. RONC LEADING-IN CONDUCTOR Filed May 2, 1923 W A/ik Patented Aug.30, 192.7.

UNITED sTATas PA E T- OFF-ICE.

VICTOR L. RONCI, OF BROOKLYN, NEW YORK, A SSIGNOR TO WESTERN ELECTRICCOM- PANY, INCORPORATED, NEW YORK, N. Y., A CORPORATION OF NEW YORK.

LEADING-IN commcron.

Application filed May 2,

This invention relates to electron dis-.

patent to W. G. Houskeeper, 1,293,441, and

having a wire passing through the disc and soldered thereto. The wireand disc are preferably composed of a highly conductive metal and arejoined together by a relatively high melting point solder containing novolatilizable material. A solder highly suit: able for this purpose isan alloy having as I one of its constituents the metal of which the discand leading-in wire are composed,

In this alloy the proportions of its constituents are such that theaddition to the alloy of moreof the metal composing the disc andleading-in wire increases the melting point of the solder. This insuresthat no leak will .(lGVlOPlIl the joint during the fusing of the disc tothe glass tube as a result of the solder softening at the temperature atwhich the fusing operation is conducted.

Referring now to the ('lrawings, Fig. 1 discloses the stem of. anelectron discharge device having leading-in wires sealed therein andFig. 2 is an enlarged sectional view through one of the seals.

The stem 10' has two tubular projecting glass members 11 through whichextend the eading-in wires 12. Each of these leading.- in wires passesthrough a thin. disc- 13 to.

4 which it is attached by solder 14, Eachdisc 13 is fused to the end ofone of the glass tubes 11 and a ring of glass 15 is fused to theopposite side of the disc, whereby is attained a vacuum ti ht jointbetween'the glass tube and the isc. The leading-in wires and thediscsare preferably composed 1923. Serial No. 638,078.

tions of copper and silver of the al oy are Such that the melting pointthereof is about the same as that of pure silver but that if more copperbe added to the alloy,'the melting point will be raised instead-of beinglowered as would be the case with sterling silver Thus, when theleading-in wire and the disc are soldered together, any copper which maybe melted out of the disc'and alloyed with the solder, increases themelt-.- 1

ing pointthereof. \V hen the disc of-a seal made in this manner is fusedto the end of the glass tube,.there is no danger of the seal failing atthe-temperature to which it is subjected while the disc is being fusedto the glass.

It has been found that a copper silver alloy containing approximately ofcopper and 20% of silver has a melting point approximately the same asthat of pure silver and theaddition of more copper to the alloy,increases its melting temperature. Such-a solder has been found to be.verysatisfactory for this purpose and seals between discs and leading-inwires made with this solder are maintained tight during the fusing ofthe disc to the glass.

NVhat is claimed is:

The method of making a leading in conductor comprising a copper wirepassing through a copper disc which consists in joining the wire to thedisc by an alloy of copper and silver the -melting point of which issubstantially the same as that of pure silver, the proportions of copperand silver being such that the addition thereto of copper from said wireand disc during the soldering operation will raise the n'ielt-ingtemperature of the solder above that of silver. I I

In witness whereof, I hereunto subscribe my name this 30th day of'April'A. D., 1923'.

VICTOR L. Ro'NoL

